MLCC Multilayer Capacitor Manufacturers
Iimbonakalo
Ukusebenzisa itekhnoloji yenkqubo ephucukileyo ukwenza i-ceramic dielectric layers inokubonelela ngesakhono esiphezulu ngelixa uphucula amandla ombane.Ii-JEC MLCC zinempendulo entle rhoqo kunye nokuthembeka okuphezulu.
Isicelo
Iikhompyutha, ii-air conditioners, iifriji, oomatshini bokuhlamba, ii-oveni zemicrowave, iiprinta, iifeksi, njl.
Inkqubo yeMveliso
Isiqinisekiso
FAQ
Umbuzo: Yintoni unobangela wokuvuza kwe-multilayer ceramic capacitors?
A: Imiba yangaphakathi
Ilize
I-void eyenziwe yi-volatilization yezinto zangaphandle ngaphakathi kwe-capacitor ngexesha lenkqubo ye-sintering.I-Voids inokukhokelela kwiisekethe ezimfutshane phakathi kwe-electrode kunye nokungaphumeleli kombane.I-voids enkulu ayinciphisi kuphela i-IR, kodwa inciphisa amandla asebenzayo.Xa umbane uvuliwe, unokubangela ukufudumeza kwendawo ngenxa yokuvuza, ukunciphisa ukusebenza kwe-insulation ye-ceramic medium, kwandisa ukuvuza, kwaye kubangele ukuqhekeka, ukuqhuma, ukuvutha kunye nezinye izinto.
Sintering Crack
Ukuqhekeka kwe-Sintering ngokuqhelekileyo kubangelwa ukupholisa ngokukhawuleza ngexesha lenkqubo ye-sintering kwaye kubonakala kwicala elithe nkqo kumphetho we-electrode.
I-Layered Delamination
Ukwenzeka kwe-delamination kaninzi kubangelwe kukunganyibiliki kakuhle okanye ukungonelanga kokudityaniswa kunye ne-sintering emva kokupakishwa.Umoya uxubene phakathi kweeleya, kwaye iintanda ezisecaleni ezijijekileyo zivela kubumdaka bangaphandle.Isenokubangelwa kukungahambelani kokwandiswa kwe-thermal emva kokuxuba izinto ezahlukeneyo.
Imiba yangaphandle
I-Thermal Shock
Ukothuka kwe-Thermal kwenzeka kakhulu ngexesha le-wave soldering, kwaye ubushushu buguquka ngokukhawuleza, okukhokelela ekuqhekekeni phakathi kwee-electrode zangaphakathi ze-capacitor.Ngokuqhelekileyo, kufuneka ifunyanwe ngomlinganiselo kwaye ijongwe emva kokusila.Ngokuqhelekileyo, iintanda ezincinci zifuna ukuqinisekiswa ngeglasi yokukhulisa.Kwiimeko ezinqabileyo, kuya kubakho ukuqhekeka okubonakalayo kwiso lenyama.
